Heltec Mesh Node T114 V2 LoRa Development Board nRF52840 SX1262 GPS BLE Low Power Arduino Positioning

Mesh Node T114 has been upgraded to the Rev2.0 version with the following changes made:

• The circuit board was changed from 4 layers to 6 layers so the RF part and the crystal oscillator part can obtain a more complete ground.
• The circuit was changed from lead-free to an immersion gold process, which is more friendly to signal transmission.
• The position of some components was adjusted.
• The RF path was optimized according to the six-layer board structure.
• The direction of the 2.4GHz Bluetooth antenna and IPEX LoRa antenna interface was changed to make them farther apart.
• The data transmission can send long data packets on Meshtastic.

Introduction and Operation Video of T114 Rev2.0 Development Board

If you want to know more about the Heltec Mesh Node T114, please watch the video on YouTube.

Operation Video

Why do we need Maker series products?

Low Power Characteristics

Summary

Mesh Node T114 is a low power consumption development board based on the nRF52840 and SX1262. It supports LoRa and Bluetooth 5.0, integrates various power interfaces (5V USB, lithium battery, and solar panel), and offers an optional 1.14-inch TFT display and GPS module as accessories. It features powerful long-distance communication capabilities, scalability, and a low power design. With the Heltec nRF52 development environment and libraries, you can use it for LoRa and LoRaWAN development work, and also use it to run open-source projects such as Meshtastic.

Main Features

• MCU nRF52840 (Bluetooth), LoRa chipset SX1262.
• Powerful display function (optional), onboard 1.14-inch TFT-LCD display contains 135(H)RGB x 240(V) dots and can display up to 262k colors.
• Low power consumption, 11 µA in deep sleep.
• Powerful display function, onboard 1.9-inch TFT-LCD display contains 170 (RGB) x 320 dots and can display up to 262k colors.
• Operation conditions: -20 to 70℃, 90% RH (non-condensing).
• Type-C USB interface with a complete voltage regulator, ESD protection, short circuit protection, RF shielding, and other protection measures.
• Compatible with Arduino; we provide development frameworks and libraries.
• Various interfaces: 1.25*2P LiPo connector, 1.25*2P solar panel connector, and 1.25*8P GNSS module connector, which greatly increase the extensibility of the board.

Docs & Resource

User Manual

SnapEmu IoT Platform

Datasheet

Schematic diagram

TFT-LCD Datasheet

Related Resources

Heltec nRF52 framework and Lib

Pin Map

Dimension

Specifications

Packing List

The default packing list without selecting any accessories is as follows:

NOTE

1. If you choose the T114 without a screen, you need to connect the device to a computer and view the status and logs through the serial port.

2. How to use?

There are two pins, DFU and FRST, that the bootloader will check upon reset or power-up:

• Double Reset: Reset twice within 500 ms to enter DFU with UF2 and CDC support (only works with nRF52840).
• DFU = LOW and FRST = HIGH: Enter bootloader with UF2 and CDC support.
• DFU = LOW and FRST = LOW: Enter bootloader with OTA, to upgrade with a mobile application such as Nordic nRF Connect/Toolbox.

More info about Heltec products:

Company Overview

• Chengdu Heltec Automation Technology Co., Ltd. (English abbreviation: Heltec Automation).
• At present, the company's research, development, and production include OLED dot matrix screens, electronic ink screens, IoT series products, LoRa supporting solutions, and high-precision temperature controllers with automatic control algorithms as the core.
• The company features a strong technical research and development team, a scientific production and manufacturing platform, and a strict quality management system.

Our Services & Strengths

Offering stable performance, cost-effective products, high-quality and superior service, our products have gained a good reputation domestically and received high evaluations in France, Germany, Russia, the United States, South Korea, and other countries.

1. Rigorous quality assurance system.
2. High level of service awareness.
3. High-quality team.
4. Components use well-known brands.
5. Quick response customer program.
6. Self-owned processing plant, rapid production, equipped with automatic SMT placement machine, automatic screen printing machine, and reflow oven.